BBT
Bare Board Test
SIP
It is used as a part to embody Package miniaturization by having dozens of passive elements and IC integrated into a module and as RF parts such as Power Amplifier and Switch to name a few.
CSP
It is mostly used for a Memory Chip since it is possible to use Gold Wire which enables Multi packaging by connecting Chip and PCB.
FLEXIBLE
Flex: It uses a Cable which connects a Connector and a Sub Board in electronic goods.
Module: It makes it possible to make electronic goods in a slim shape and realizes high performance with high speed, high frequency, and low noise.
FCCSP
It is mostly used in the AP(Application Processor) Chip in the Mobile IT products.
What is BBT?
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Bare Board Test
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It is a process to test electronically based on GERBER DATA designed for OPEN/SHORT test circuit boards.